Patent Assignment
Reel/Frame 020399/0467
Assignment of Assignor's Interest
Recorded: 2008-01-15
Pages: 2
Assignors
KUZUHARA, TAKESHI
Executed: 2007-10-26
KOMURA, ATSUSHI
Executed: 2007-10-26
KATADA, MITSUTAKA
Executed: 2007-10-26
NARUSE, TAKAYOSHI
Executed: 2007-10-26
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Semiconductor Device, Wiring of Semiconductor Device, and Method of Forming Wiring