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Patent Assignment
Reel/Frame 020404/0850

Assignment of Assignor's Interest

Recorded: 2008-01-15 Pages: 3
Assignor
LEE, JONG-HYUN
Executed: 2007-07-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Defect Analysis Methods for Semiconductor Integrated Circuit Devices and Defect Analysis Systems
Patent: 7,822,561 →
Application: 12/007,706 →
Publication: US 2008/0172190