Patent Assignment
Reel/Frame 020405/0490
Assignment of Assignor's Interest
Recorded: 2008-01-24
Pages: 9
Assignors
LEE, JIN-YUAN, MR.
Executed: 2001-02-28
LIN, MOU-SHIUNG, MR.
Executed: 2001-02-28
HUANG, CHING-CHENG, MR.
Executed: 2001-02-28
Assignee
MEGICA CORPORATION
ROOM 301/302,NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Low fabrication cost, fine pitch and high reliability solder bump
Application:
11/930,156 →
Publication:
US 2008/0054459
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.