IP Library Assignment 020419/0113
Patent Assignment
Reel/Frame 020419/0113

Assignment of Assignor's Interest

Recorded: 2008-01-25 Pages: 2
Assignor
HIRANO, SEIICHI
Executed: 2006-12-20
Assignee
DAIKIN INDUSTRIES, LTD.
UMEDA CENTER BUILDING, 4-12, NAKAZAKI-NISHI 2-CHOME, KITA-KU, OSAKA-SHI, OSAKA, 530-8323, JAPAN
Covered Property (1)
Curable Composition, Molded Article Obtained from Same and Process for Production of Molded Article
Patent: 8,211,964 →
Application: 11/996,917 →
Publication: US 2010/0144948