Patent Assignment
Reel/Frame 020421/0796
Assignment of Assignor's Interest
Recorded: 2008-01-22
Pages: 5
Assignors
SUZUKI, KENJI
Executed: 2008-01-21
JOMEN, MIHO
Executed: 2008-01-21
RULLAN, JONATHAN
Executed: 2008-01-22
Assignee
TOKYO ELECTRON LIMITED
TPS BROADCAST CENTER, 3-6 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-8481, JAPAN
Covered Property
(1)
Method for Integrating Selective Low-Temperature Ruthenium Deposition into Copper Metallization of a Semiconductor Device