Patent Assignment
Reel/Frame 020422/0006
Assignment of Assignor's Interest
Recorded: 2008-01-28
Pages: 2
Assignor
YANG, WEN-KUN
Executed: 2008-01-25
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP, HSINCHU COUNTY, 303, TAIWAN
Covered Property
(1)
Fan Out Type Wafer Level Package Structure and Method of the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name
Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest
Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →