IP Library Assignment 020428/0472
Patent Assignment
Reel/Frame 020428/0472

Assignment of Assignor's Interest

Recorded: 2008-01-16 Pages: 2
Assignors
SHYLO, SERGIY
Executed: 2007-10-24
YUN, MI JEONG
Executed: 2007-10-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Light Emitting Diode Chip Package
Patent: 8,269,239 →
Application: 12/007,836 →
Publication: US 2008/0173889
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →