Patent Assignment
Reel/Frame 020430/0988
Assignment of Assignor's Interest
Recorded: 2008-01-29
Pages: 2
Assignor
TACHIBANA, HIROAKI
Executed: 2007-12-26
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Electrolytic Ni Plating Apparatus and Method of Manufacturing Semiconductor Device
Application:
12/021,357 →
Publication:
US 2008/0314742
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.