IP Library Assignment 020430/0988
Patent Assignment
Reel/Frame 020430/0988

Assignment of Assignor's Interest

Recorded: 2008-01-29 Pages: 2
Assignor
TACHIBANA, HIROAKI
Executed: 2007-12-26
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Electrolytic Ni Plating Apparatus and Method of Manufacturing Semiconductor Device
Application: 12/021,357 →
Publication: US 2008/0314742
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 2, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025235/0423 →
Security Interest Mar 10, 2016
From: TSI TECHNOLOGIES LLC
To: MICROWIRE, LLC
Reel/Frame 037949/0799 →