IP Library Assignment 020450/0891
Patent Assignment
Reel/Frame 020450/0891

Assignment of Assignor's Interest

Recorded: 2008-01-31 Pages: 5
Assignors
JUNG, GI JO
Executed: 2008-01-15
KANG, IN SOO
Executed: 2008-01-15
KIM, JONG HEON
Executed: 2008-01-08
BAEK, SEUNG DAE
Executed: 2008-01-08
Assignees
NEPES CORPORATION
654-2, GAK-RI, OCHANG-MYUN, CHEONGWON-GUN, CHUNGBUK, 363-883, KOREA, REPUBLIC OF
NEPES PTE., LTD.
12 ANG MO KIO STREET 65, SINGAPORE, SINGAPORE
Covered Property (1)
Semiconductor Package and Fabrication Method Thereof
Patent: 7,952,210 →
Application: 12/023,761 →
Publication: US 2008/0203583
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 31, 2016
From: NEPES PTE., LTD.
To: POWERTECH TECHNOLOGY (SINGAPORE) PTE. LTD.
Reel/Frame 038755/0553 →