Patent Assignment
Reel/Frame 020452/0156
Assignment of Assignor's Interest
Recorded: 2008-01-31
Pages: 3
Assignor
JUNG, GI JO
Executed: 2008-01-15
Assignee
NEPES CORPORATION
654-2, GAK-RI, OCHANG-MYUN, CHEONGWON-GUN, CHUNGBUK, 363-883, KOREA, REPUBLIC OF
Covered Property
(1)
Ultra Slim Semiconductor Package and Method of Fabricating the Same