IP Library › Assignment 020493/0469
Patent Assignment
Reel/Frame 020493/0469

Assignment of Assignor's Interest

Recorded: 2008-02-11 Pages: 2
Assignors
HORII, SADAYOSHI
Executed: 2008-01-24
ITATANI, HIDEHARU
Executed: 2008-01-24
HARADA, KAZUHIRO
Executed: 2008-01-24
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTO-KANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
Covered Property (1)
Manufacturing Method of Semiconductor Device, and Substrate Processing Apparatus
Patent: 8,435,905 →
Application: 11/921,936 →
Publication: US 2009/0035947
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →