Patent Assignment
Reel/Frame 020493/0751
Assignment of Assignor's Interest
Recorded: 2008-02-11
Pages: 8
Assignee
TESSERA INTERCONNECT MATERIALS, INC.
3099 ORCHARD DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Method of manufacturing a multi-layer wiring board using a metal member having a rough surface
Application:
11/811,066 →
Publication:
US 2008/0128288
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.