Patent Assignment
Reel/Frame 027622/0384
Merger
Recorded: 2012-01-30
Received: 2012-01-30
Pages: 5
Assignor
TESSERA INTERCONNECT MATERIALS, INC.
Executed: 2011-12-19
Assignee
INVENSAS CORPORATION
2702 ORCHARD PARKWAY, SAN JOSE, CA, USA 95134, UNITED STATES
Covered Properties
(36)
Table-Based Resource Mapping for Downlink Control Channels in a Wireless System Base Station
Application:
13/362,072 →
Structure and Method of Making Interconnect Element, and Multilayer Wiring Board Including the Interconnect Element
Application:
13/085,126 →
Structure and Method of Making Interconnect Element Having Metal Traces Embedded in Surface of Dielectric
Application:
12/941,511 →
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
Application:
12/658,926 →
Chip Capacitor Embedded Pwb
Application:
12/519,950 →
Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
Application:
12/462,208 →
Microelectronic Interconnect Element with Decreased Conductor Spacing
Application:
12/459,864 →
Interconnection Element for Electric Circuits
Application:
12/317,707 →
Bump Structure Formed from Using Removable Mandrel
Application:
12/290,873 →
Method of fabricating substrate with copper bump interface
Application:
61/189,618 →
Multilayer substrate with interconnection vias and method of manufacturing the same
Application:
12/228,537 →
Microelectronic interconnect element with decreased conductor spacing
Application:
61/134,457 →
Member for Interconnecting Wiring Films and Method for Producing the Same
Application:
11/662,024 →
Multilayer wiring board for an electronic device
Application:
12/008,546 →
Structure and method of making interconnect element having metal traces embedded in surface of dielectric
Application:
11/897,200 →
Multilayer substrate with interconnection vias and method of manufacturing the same
Application:
60/964,916 →
Method for Manufacturing Multilayer Wiring Board
Application:
11/720,711 →
Method of manufacturing a multi-layer wiring board using a metal member having a rough surface
Application:
11/811,066 →
Structure and method of making interconnect element having metal traces embedded in surface of dielectric
Application:
11/805,300 →
Methods of Making Microelectronic Assemblies
Application:
11/784,810 →
Multilayer Wiring Board for an Electronic Device
Application:
11/657,286 →
Chip capacitor embedded PWB
Application:
60/875,730 →
Apparatus and method for distributing a liquid onto a surface of an item
Application:
11/585,287 →
Manufacturing Method for Wiring Circuit Substrate
Application:
11/487,747 →
Apparatus and method for distributing a liquid onto a surface of an item
Application:
11/363,401 →
Structure and Method of Making Interconnect Element, and Multilayer Wiring Board Including the Interconnect Element
Application:
11/239,744 →
Interlayer member used for producing multilayer wiring board and method of producing the same
Application:
11/085,108 →
Connecting Member Between Wiring Films, Manufacturing Method Thereof, and Manufacturing Method of Multilayer Wiring Substrate
Application:
11/029,423 →
Multilayer Wiring Board for an Electronic Device
Application:
10/880,588 →
Manufacturing Method for Wiring Circuit Substrate
Application:
10/823,611 →
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
Application:
10/812,349 →
Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board
Application:
10/450,844 →
Connecting Member Between Wiring Films, Manufacturing Method Thereof, and Manufacturing Method of Multilayer Wiring Substrate
Application:
10/358,229 →
Wiring Circuit Substrate and Manufacturing Method Therefor
Application:
10/287,633 →
Manufacturing Method for Wiring Circuit Substrates
Application:
10/139,237 →
Fabrication Method of Wiring Substrate for Mounting Semiconductor Element and Semiconductor Device
Application:
10/072,351 →