Method for manufacturing multilayer wiring board
View Patent ↗A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.
1. A method for manufacturing a multilayer wiring board, the method comprising:
forming an insulating layer on a base provided with a bump made of copper for interlayer connection;
bonding a copper foil onto the insulating layer by lamination by sandwiching the copper foil between stainless steel plates; and
patterning the copper foil, wherein a respective metal foil is interposed at least between each of the stainless steel plates and the copper foil, the stainless steel plate directly contacting the respective metal foil, so as to reduce concentration of pressure at locations of the bumps at the time of the lamination.
2. The method for manufacturing a multilayer wiring board according to claim 1 , wherein the metal foil is a copper foil.
3. The method for manufacturing a multilayer wiring board according to claim 1 , wherein the insulating layer is made of a polyimide resin.
4. The method for manufacturing a multilayer wiring board according to claim 1 , wherein the lamination includes a thermocompression bonding of the copper foil.
5. A method for manufacturing a multilayer wiring board, the method comprising:
forming an insulating layer on a base provided with a bump made of copper for interlayer connection;
bonding a copper foil onto the insulating layer by lamination by sandwiching the copper foil between stainless steel plates; and
patterning the copper foil, wherein a metal foil is interposed at least between each of the stainless steel plates and the copper foil so as to reduce concentration of pressure at locations of the bumps at the time of the lamination,
wherein the metal foil is provided with a mold release layer at a surface of the metal foil, and the mold release layer is formed of a plated layer or an oxidation layer.
6. The method for manufacturing a multilayer wiring board according to claim 5 , wherein the mold release layer includes an antirust layer.
7. The method for manufacturing a multilayer wiring board according to claim 5 , wherein the metal foil is a copper foil.
8. The method for manufacturing a multilayer wiring board according to claim 5 , wherein the insulating layer is made of a polyimide resin.
9. The method for manufacturing a multilayer wiring board according to claim 5 , wherein the lamination includes a thermocompression bonding of the copper foil.