IP Library › Assignment 019633/0181
Patent Assignment
Reel/Frame 019633/0181

Assignment of Assignor's Interest

Recorded: 2007-08-01 Pages: 10
Assignors
SHIMIZU, KAZUHIRO
Executed: 2007-06-13
YAGI, MASANOBU
Executed: 2007-06-18
HANAMURA, KENICHIRO
Executed: 2007-06-14
TAKAYASU, MITSUYUKI
Executed: 2007-06-13
NAGAI, KIYOE
Executed: 2007-06-14
IIJIMA, TOMOO
Executed: 2007-07-15
Assignees
SONY CHEMICAL & INFORMATION DEVICE CORPORATION
GATE CITY OSAKI EAST TOWER 8F, 11-2, OSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
TESSERA INTERCONNECT MATERIALS, INC.
3099 ORCHARD DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Method for Manufacturing Multilayer Wiring Board
Patent: 8,112,881 →
Application: 11/720,711 →
Publication: US 2008/0110018
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jan 30, 2012
From: TESSERA INTERCONNECT MATERIALS, INC.
To: INVENSAS CORPORATION
Reel/Frame 027622/0384 →
Change of Name Mar 1, 2013
From: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 029908/0665 →