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App. No. 12/228,537 · Confirmation No. 5506

Multilayer substrate with interconnection vias and method of manufacturing the same

Expressly Abandoned -- During Examination View Publication ↗
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 Code Description Pages PDF
2011-02-16 ABN Abandonment 2 View
2011-01-26 EABN Letter Express Abandonment of the application 2 View
2011-01-26 N417 Electronic Filing System Acknowledgment Receipt 2 View
2009-03-19 NTC.PUB Notice of Publication 1 View
2008-12-15 LET. Miscellaneous Incoming Letter 2 View
2008-12-15 OATH Oath or Declaration filed 4 View
2008-12-08 APP.FILE.REC Filing Receipt 3 View
2008-11-24 PEFR Applicant Response to Pre-Exam Formalities Notice 5 View
2008-11-24 XT/ Extension of Time 2 View
2008-11-24 OATH Oath or Declaration filed 4 View
2008-11-24 A.PE Preliminary Amendment 1 View
2008-11-24 SPEC Specification 2 View
2008-11-24 REM Applicant Arguments/Remarks Made in an Amendment 2 View
2008-11-24 DRW Drawings-only black and white line drawings 11 View
2008-09-03 APP.FILE.REC Filing Receipt 3 View
2008-09-03 NTC.MISS.PRT Notice to File Missing Parts 2 View
2008-08-13 TRNA Transmittal of New Application 1 View
2008-08-13 SPEC Specification 21 View
2008-08-13 CLM Claims 4 View
2008-08-13 ABST Abstract 1 View
2008-08-13 DRW Drawings-only black and white line drawings 11 View
2008-08-13 ADS Application Data Sheet 5 View
2008-08-13 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
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Quick Facts
App. No.
12/228,537
Filed
2008-08-13
Pub. No.
US20090071707A1
Art Unit
2835