Patent Application
Provisional
App. No. 60/964,916
· Confirmation No. 5528
Multilayer substrate with interconnection vias and method of manufacturing the same
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-08-30 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-08-15 | TRNA |
Transmittal of New Application | 3 | View | |
| 2007-08-15 | SPEC |
Specification | 24 | View | |
| 2007-08-15 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2007-08-15 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2007-08-15 | ADS |
Application Data Sheet | 5 | View |
Inventors
Kimitaka Endo
Yokohama, JAPAN
Philip Damberg
Cupertino, CA
Craig S. Mitchell
San Jose, CA
Sean Moran
Berlingame, CA
Christopher Wade
Los Gatos, CA
Belgacem Haba
Saratoga, CA
John Riley
Dallas, TX
Attorneys & Agents of Record
Prosecution
- Customer No.
- 38091
- Docket No.
- TESSERA 3.8-578
- Confirmation No.
- 5528
from
HABA, BELGACEM,
MORAN, SEAN,
DAMBERG, PHILIP,
MITCHELL, CRAIG S.,
WADE, CHRISTOPHER,
ENDO, KIMITAKA,
RILEY, JOHN
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2008-04-09
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Quick Facts
- App. No.
- 60/964,916
- Filed
- 2007-08-15
External Links