Patent Assignment
Reel/Frame 022103/0348
Corrected Recordation Cover Sheet to Correct Date of Execution of Inventor Craig S. Mitchell at Reel 021978/Frame 0362
Recorded: 2009-01-13
Pages: 18
Assignors
ENDO, KIMITAKA
Executed: 2008-10-31
DAMBERG, PHILIP
Executed: 2008-11-05
MITCHELL, CRAIG S.
Executed: 2008-11-20
MORAN, SEAN
Executed: 2008-09-18
WADE, CHRISTOPHER
Executed: 2008-09-19
HABA, BELGACEM
Executed: 2008-09-18
RILEY, JOHN
Executed: 2008-11-17
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, USA 95134
Covered Property
(1)
Multilayer substrate with interconnection vias and method of manufacturing the same
Application:
12/228,537 →
Publication:
US 2009/0071707
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 12, 2008
From: ENDO, KIMITAKA; DAMBERG, PHILIP; MITCHELL, CRAIG S.; MORAN, SEAN
To: TESSERA, INC.
Reel/Frame 021978/0362 →
Assignment of Assignor's Interest
Mar 31, 2011
From: TESSERA, INC.
To: TESSERA INTERCONNECT MATERIALS, INC.
Reel/Frame 026110/0366 →
Merger
Jan 30, 2012
From: TESSERA INTERCONNECT MATERIALS, INC.
To: INVENSAS CORPORATION
Reel/Frame 027622/0384 →