IP Library › Patent Application 61189618
Patent Application Provisional
App. No. 61/189,618 · Confirmation No. 8183

Method of fabricating substrate with copper bump interface

Provisional Application Expired
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 Code Description Pages PDF
2009-10-23 CFILE Request for Corrected Filing Receipt 1 View
2009-07-27 CFILE Request for Corrected Filing Receipt 5 View
2009-07-09 APP.FILE.REC Filing Receipt 3 View
2009-07-09 N572 Response - Re: Informal Power of Attorney (PTOL-308) 1 View
2009-07-01 CFILE Request for Corrected Filing Receipt 1 View
2009-04-10 LET. Miscellaneous Incoming Letter 1 View
2008-09-19 LET. Miscellaneous Incoming Letter 6 View
2008-09-19 ADS Application Data Sheet 3 View
2008-09-09 APP.FILE.REC Filing Receipt 3 View
2008-08-21 TRNA Transmittal of New Application 2 View
2008-08-21 SPEC Specification 17 View
2008-08-21 DRW Drawings-only black and white line drawings 8 View
2008-08-21 ADS Application Data Sheet 3 View
2008-08-21 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
61/189,618
Filed
2008-08-21