Patent Assignment
Reel/Frame 023067/0643
Assignment of Assignor's Interest
Recorded: 2009-08-06
Received: 2009-08-06
Pages: 4
Assignor
TESSERA, INC.
Executed: 2009-08-04
Assignee
TESSERA INTERCONNECT MATERIALS, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CA, 95134, UNITED STATES
Covered Property
(1)
Method of fabricating substrate with copper bump interface
Application:
61/189,618 →