Patent Assignment
Reel/Frame 021978/0121
Assignment of Assignor's Interest
Recorded: 2008-12-12
Received: 2008-12-12
Pages: 10
Assignors
WADE, CHRISTOPHER PAUL
Executed: 2008-10-07
RYU, CHANG MYUNG
Executed: 2008-10-19
HABA, BELGACEM
Executed: 2008-10-21
ENDO, KIMITAKA
Executed: 2008-11-14
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CA, 95134, UNITED STATES
Covered Property
(1)
Method of fabricating substrate with copper bump interface
Application:
61/189,618 →