Patent Assignment
Reel/Frame 020506/0562
Assignment of Assignor's Interest
Recorded: 2008-02-14
Pages: 4
Assignors
KITAE, TAKASHI
Executed: 2006-10-03
NAKATANI, SEIICHI
Executed: 2006-10-03
KOJIMA, TOSHIYUKI
Executed: 2006-10-03
KOMATSU, SHINGO
Executed: 2006-10-03
YAMASHITA, YOSHIHISA
Executed: 2006-10-03
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Method for Forming Solder Bump and Method for Mounting Semiconductor Device Using a Solder Powder Resin Compostition
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.