IP Library › Assignment 020514/0261
Patent Assignment
Reel/Frame 020514/0261

Assignment of Assignor's Interest

Recorded: 2008-02-04 Pages: 3
Assignors
TANAKA, TAKEKAZU
Executed: 2008-01-21
TAKAHASHI, KOUHEI
Executed: 2008-01-21
OKABE, SEIJI
Executed: 2008-01-21
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Device Including a Coupling Region Which Includes Layers of Aluminum and Copper Alloys
Patent: 7,791,198 →
Application: 12/068,191 →
Publication: US 2008/0203568
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 2, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025235/0497 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →