Patent Assignment
Reel/Frame 020514/0741
Assignment of Assignor's Interest
Recorded: 2008-02-15
Pages: 3
Assignor
ISHIGURO, TAKESHI
Executed: 2008-01-10
Assignee
ICEMOS TECHNOLOGY CORPORATION
P.O. BOX 24619, TEMPE, ARIZONA, 85285
Covered Property
(1)
Methods for Manufacturing a Trench Type Semiconductor Device Having a Thermally Sensitive Refill Material
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.