IP Library Assignment 020517/0277
Patent Assignment
Reel/Frame 020517/0277

Assignment of Assignor's Interest

Recorded: 2008-02-15 Pages: 2
Assignors
DAUBENSPECK, TIMOTHY H.
Executed: 2008-02-14
SULLIVAN, TIMOTHY D.
Executed: 2008-02-14
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Solder Interconnect Pads with Current Spreading Layers
Patent: 7,868,453 →
Application: 12/032,158 →
Publication: US 2009/0206479
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 29, 2012
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 028867/0216 →