Patent Assignment
Reel/Frame 020533/0466
Assignment of Assignor's Interest
Recorded: 2008-02-18
Pages: 4
Assignee
UTAC THAI LIMITED
237 LASSALLE ROAD, BANGUA, BANGKOK 10260, THAILAND
Covered Property
(1)
Molded leadframe substrate semiconductor package
Patent:
9,711,343 →
Application:
12/002,054 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.