Patent Assignment
Reel/Frame 020534/0140
Assignment of Assignor's Interest
Recorded: 2008-02-06
Pages: 4
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Having Stress Alleviating Portion Positioned at Outer Circumference of Chip, Wiring Substrate, and Method for Producing the Same
Application:
12/068,438 →
Publication:
US 2008/0203564
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.