Patent Assignment
Reel/Frame 020568/0052
Assignment of Assignor's Interest
Recorded: 2008-02-15
Pages: 5
Assignors
MIYATA, TOSHIMITSU
Executed: 2008-01-09
HAYASHIDA, AKIRA
Executed: 2008-01-09
SHIMADA, MASAKAZU
Executed: 2008-01-09
KITAMURA, KIMIO
Executed: 2008-02-07
TANAKA, KENJI
Executed: 2008-02-07
Assignees
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
TEITOKUSHA CO., LTD.
1-5-32, SHIGITA, JOTO-KU, OSAKA-SHI, OSAKA, 536-0015, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Heating Apparatus for Use in the Same, Method of Manufacturing Semiconductors with Those Apparatuses, and Heating Element Supporting Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.