IP Library Assignment 020572/0733
Patent Assignment
Reel/Frame 020572/0733

Assignment of Assignor's Interest

Recorded: 2008-02-27 Pages: 3
Assignors
OZAKI, TAKASHI
Executed: 2008-01-24
KASAHARA, OSAMU
Executed: 2008-01-28
NODA, TAKAAKI
Executed: 2008-01-31
MAEDA, KIYOHIKO
Executed: 2008-01-28
MORIYA, ATSUSHI
Executed: 2008-01-31
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO 101-8980, JAPAN
Covered Property (1)
Semiconductor Device Manufacturing Method and Substrate Processing Apparatus
Patent: 8,293,646 →
Application: 11/667,078 →
Publication: US 2009/0117752
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →