IP Library Assignment 020577/0579
Patent Assignment
Reel/Frame 020577/0579

Assignment of Assignor's Interest

Recorded: 2008-02-28 Pages: 3
Assignors
YANG, CHIH-CHAO
Executed: 2008-02-27
NITTA, SATYA V.
Executed: 2008-02-28
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Bilayer Metal Capping Layer for Interconnect Applications
Patent: 7,834,457 →
Application: 12/039,280 →
Publication: US 2009/0218691