Patent Assignment
Reel/Frame 020580/0875
Assignment of Assignor's Interest
Recorded: 2008-02-29
Pages: 4
Assignors
IKEBE, NOBUAKI
Executed: 2007-06-26
IWAFUCHI, TOSHIAKI
Executed: 2007-07-02
SATOU, MICHIHIRO
Executed: 2007-07-19
YAMAGATA, YUJI
Executed: 2007-07-28
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO 108-0075, JAPAN
Covered Property
(1)
Flip Chip Semiconductor Packaging Device and Testing Method Using First and Second Reflectors for Determining Gap Between Chip and Circuit Board or First and Second Chips