Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips
A semiconductor device includes: a circuit board; a semiconductor chip mounted over the circuit board with a predetermined gap therebetween and electrically connected to the circuit board by a protruding electrode; a first resin material filled into the gap between the circuit board and the semiconductor chip; a second resin material that seals the semiconductor chip mounted over the circuit board; a first reflector which is formed on a surface of the circuit board on the semiconductor chip side and reflects a predetermined testing light; and a second reflector which is formed on a surface of the semiconductor chip on the circuit board side and reflects the predetermined testing light.
1. A semiconductor device comprising:
a circuit board;
a semiconductor chip mounted over the circuit board with a predetermined gap therebetween and the circuit board and electrically connected to the circuit board by a protruding electrode;
a first resin material filled into the gap between the circuit board and the semiconductor chip;
a second resin material that seals the semiconductor chip mounted over the circuit board;
a first reflector which is formed on a surface of the circuit board on the semiconductor chip side and reflects a predetermined testing light; and
a second reflector which is formed on a surface of the semiconductor chip on the circuit board side and reflects the predetermined testing light.
2. The semiconductor device according to claim 1 , wherein the first reflector is formed in a process of wiring the circuit board.
3. The semiconductor device according to claim 1 , wherein the second reflector is formed in a process of wiring the semiconductor chip.
4. The semiconductor device according to claim 1 , wherein a predetermined shape is derived with an overlay of the first and second reflectors.
5. The semiconductor device according to claim 1 , wherein the predetermined testing light is an infrared laser.
6. A semiconductor device comprising:
a first semiconductor chip;
a second semiconductor chip mounted over the first semiconductor chip with a predetermined gap therebetween and electrically connected to the first semiconductor chip by a protruding electrode;
a resin material filled into the gap between the first and second semiconductor chips;
a first reflector which is formed on a surface of the first semiconductor chip on the second semiconductor chip side and reflects a predetermined testing light; and
a second reflector which is formed on a surface of the second semiconductor chip on the first semiconductor chip side and reflects the predetermined testing light.