Patent Assignment
Reel/Frame 020597/0303
Assignment of Assignor's Interest
Recorded: 2008-03-04
Pages: 10
Assignor
FOXCONN TECHNOLOGY CO., LTD.
Executed: 2008-02-22
Assignees
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
NO. 2, 2ND DONGHUAN ROAD, LONGHUA TOWN, BAO'AN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE, 518109, CHINA
FOXCONN TECHNOLOGY CO., LTD.
3-2, CHUNG SHAN ROAD, TU-CHENG CITY, TAIPEI HSIEN, TAIWAN
Covered Properties
(6)
Heat Dissipating Device
Heat Dissipating Device
Heat Dissipation Device
Heat Dissipating Assembly with Fan Fastening Device
Liquid Cooling Device
Heat Dissipation Device
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 23, 2005
From: CHEN, CHUN-CHI; ZHOU, SHI-WEN; FU, MENG; LIANG, CHI
To: FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 016597/0199 →
Assignment of Assignor's Interest
May 23, 2005
From: YU, GUANG; LEE, HSIEH-KUN; LU, CUI-JUN
To: FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 016606/0476 →
Assignment of Assignor's Interest
Jun 24, 2005
From: WANG, DONG; LEE, TSUNG-LUNG; HE, LI
To: FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 016825/0478 →
Assignment of Assignor's Interest
Nov 1, 2005
From: LEE, HSIEH-KUN; CHEN, CHUN-CHI; WUNG, SHIN-HSUU; YU, GUANG
To: FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 017188/0653 →
Assignment of Assignor's Interest
Nov 1, 2005
From: HE, LI
To: FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 017189/0699 →
Assignment of Assignor's Interest
Jan 30, 2006
From: LEE, HSIEH-KUN; XIA, WAN-LIN; LI, TAO; XIAO, MIN-QI
To: FOXCONN TECHNOLOGY CO., LTD.
Reel/Frame 017533/0160 →