Patent Assignment
Reel/Frame 020605/0639
Assignment of Assignor's Interest
Recorded: 2008-03-05
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2008-02-21
CHIOU, WEN-CHIH
Executed: 2008-02-21
WU, WENG-JIN
Executed: 2008-02-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Protection for Bonding Pads and Methods of Formation