Patent Assignment
Reel/Frame 020608/0286
Assignment of Assignor's Interest
Recorded: 2008-03-06
Pages: 2
Assignors
KOBAYASHI, YASUSHI
Executed: 2007-12-11
NAKATA, YOSHIHIRO
Executed: 2007-12-11
OZAKI, SHIROU
Executed: 2007-12-11
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property
(1)
Insulating Film Material, Multilayer Interconnection Structure, Method for Manufacturing Same, and Method for Manufacturing Semiconductor Device