Patent Assignment
Reel/Frame 020611/0006
Assignment of Assignor's Interest
Recorded: 2008-03-06
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDA-CHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Interposer, a Method for Manufacturing the Same and an Electronic Circuit Package