Patent Assignment
Reel/Frame 020613/0633
Assignment of Assignor's Interest
Recorded: 2008-02-26
Pages: 2
Assignors
ENDO, TAKESHI
Executed: 2008-02-14
YAMAMOTO, TSUYOSHI
Executed: 2008-02-15
OKUNO, EIICHI
Executed: 2008-02-15
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Sic Semiconductor Device and Method for Manufacturing the Same