Patent Assignment
Reel/Frame 020614/0058
Assignment of Assignor's Interest
Recorded: 2008-03-07
Pages: 4
Assignors
CHIOU, WEN-CHIH
Executed: 2008-02-18
YU, CHEN-HUA
Executed: 2008-02-18
WU, WENG-JIN
Executed: 2008-02-18
HU, JUNG-CHIH
Executed: 2008-02-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, R.O.C., TAIWAN
Covered Property
(1)
Methods of Forming Through Via