Patent Assignment
Reel/Frame 020615/0717
Assignment of Assignor's Interest
Recorded: 2008-03-07
Pages: 5
Assignors
SUZUKI, KENJI
Executed: 2008-03-04
GOMI, ATSUSHI
Executed: 2008-03-07
JOMEN, MIHO
Executed: 2008-03-04
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Void-Free Copper Filling of Recessed Features Using a Smooth Non-Agglomerated Copper Seed Layer