Patent Assignment
Reel/Frame 020620/0430
Assignment of Assignor's Interest
Recorded: 2008-03-06
Pages: 2
Assignee
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW (IMEC)
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method for Bonding a Die or Substrate to a Carrier
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.