Patent Assignment
Reel/Frame 020630/0385
Assignment of Assignor's Interest
Recorded: 2008-03-11
Pages: 4
Assignors
LIANG, ZHENXIAN
Executed: 2008-03-05
CHEN, CHINGCHI
Executed: 2007-03-05
DEGNER, MICHAEL W.
Executed: 2007-03-05
Assignee
FORD GLOBAL TECHNOLOGIES LLC
330 TOWN CENTER DRIVE, SUITE 800 SOUTH, DEARBORN, MICHIGAN, 48126
Covered Property
(1)
Direct Dipping Cooled Power Module and Packaging