Patent Assignment
Reel/Frame 020649/0780
Assignment of Assignor's Interest
Recorded: 2008-03-04
Pages: 2
Assignors
KANG, UN BYOUNG
Executed: 2008-01-18
KWON, YONG HWAN
Executed: 2008-01-18
LEE, CHUNG SUN
Executed: 2008-01-18
KWON, WOON SEONG
Executed: 2008-01-18
JANG, HYUNG SUN
Executed: 2008-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing a Semiconductor Device Having an Even Coating Thickness Using Electro-Less Plating, and Related Device