Patent Assignment
Reel/Frame 020655/0581
Assignment of Assignor's Interest
Recorded: 2008-03-14
Pages: 3
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming Tungsten Film Having Low Resistivity and Good Surface Roughness and Method for Forming Wiring of Semiconductor Device Using the Same