Patent Assignment
Reel/Frame 020681/0416
Assignment of Assignor's Interest
Recorded: 2008-03-20
Pages: 3
Assignors
SCHWEGLER, BRUCE
Executed: 2008-03-19
PARK, KEE W.
Executed: 2008-03-20
VESEY, JEFF
Executed: 2008-03-19
Assignee
INTEGRATED DEVICE TECHNOLOGY, INC.
6024 SILVER CREEK VALLEY ROAD, SAN JOSE, CALIFORNIA, 95138
Covered Property
(1)
Circuit Board Assembly and Packaged Integrated Circuit Device with Power and Ground Channels
Patent:
7,847,404 →
Application:
12/052,234 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Release of Security Interest
Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →