Patent Assignment
Reel/Frame 020700/0447
Assignment of Assignor's Interest
Recorded: 2008-03-26
Pages: 3
Assignee
NANYA TECHNOLOGY CORPORATION
HWA-YA TECHNOLOGY PARK 669,FUHSING 3 RD. KUEISHAN, TAOYUAN, TAIWAN
Covered Property
(1)
Stacked-Type Chip Package Structure and Fabrication Method Thereof