Patent Assignment
Reel/Frame 020713/0707
Assignment of Assignor's Interest
Recorded: 2008-03-27
Pages: 3
Assignors
FAN, WEN-JENG
Executed: 2008-03-13
LIU, YI-LING
Executed: 2008-03-13
HUANG, SHIN-HUI
Executed: 2008-03-13
YU, TSAI-CHUAN
Executed: 2008-03-17
Assignee
POWERTECH TECHNOLOGY INC.
NO. 26, DATONG RD., HSINCHU INDUSTRIAL PARK, HUKOU SHIANG, HSINCHU, TAIWAN
Covered Property
(1)
Window Type Bga Semiconductor Package and Its Substrate