Patent Assignment
Reel/Frame 020727/0841
Assignment of Assignor's Interest
Recorded: 2008-03-31
Pages: 9
Assignors
KAPUSTA, CHRISTOPHER JAMES
Executed: 2008-03-28
CUNNINGHAM, DONALD
Executed: 2008-03-28
SAIA, RICHARD JOSEPH
Executed: 2008-03-28
DUROCHER, KEVIN
Executed: 2008-03-31
IANNOTTI, JOSEPH
Executed: 2008-03-31
HAWKINS, WILLIAM
Executed: 2008-03-31
Assignee
GENERAL ELECTRIC COMPANY
1 RIVER ROAD, SCHENECTADY, NEW YORK, 12345
Covered Property
(1)
System and Method of Forming a Wafer Scale Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 20, 2025
From: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
To: EDISON INNOVATIONS, LLC
Reel/Frame 071674/0420 →
Change of Name
Jun 23, 2025
From: GE INTELLECTUAL PROPERTY LICENSING, LLC
To: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 071692/0511 →
Assignment of Assignor's Interest
Jun 23, 2025
From: GENERAL ELECTRIC COMPANY
To: GE INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 071704/0816 →