IP Library Assignment 020731/0098
Patent Assignment
Reel/Frame 020731/0098

Assignment of Assignor's Interest

Recorded: 2008-03-28 Pages: 7
Assignors
KUROSAWA, INETARO
Executed: 2008-01-08
HASHIMOTO, YUKIO
Executed: 2008-01-08
Assignee
TESSERA INTERCONNECT MATERIALS, INC.
3099 ORCHARD DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Structure and method of making interconnect element having metal traces embedded in surface of dielectric
Application: 11/805,300 →
Publication: US 2008/0136041
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jan 30, 2012
From: TESSERA INTERCONNECT MATERIALS, INC.
To: INVENSAS CORPORATION
Reel/Frame 027622/0384 →