Assignment of Assignor's Interest

Recorded: 2008-04-01 Pages: 3

Assignor

WILSON, ROBIN

Executed: 2008-03-21

Assignee

ICEMOS TECHNOLOGY CORPORATION

P.O. BOX 24619, TEMPE, ARIZONA, 85285

Covered Property (1)

Bonded Wafer Substrate for Use in Mems Structures

Application: 61/040,210 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.