IP Library › Assignment 020771/0292
Patent Assignment
Reel/Frame 020771/0292

Assignment of Assignor's Interest

Recorded: 2008-04-08 Pages: 2
Assignors
HARAGUCHI, YUKIKO
Executed: 2007-11-30
KUMAKAWA, TAKAHIRO
Executed: 2007-11-30
YUI, TAKASHI
Executed: 2007-11-30
WATASE, KAZUMI
Executed: 2007-11-30
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Semiconductor Wafer, Method of Manufacturing the Same and Semiconductor Device
Patent: 7,964,475 →
Application: 11/951,441 →
Publication: US 2008/0135975
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 20, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0516 →
Assignment of Assignor's Interest Feb 3, 2014
From: PANASONIC CORPORATION (FORMERLY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.)
To: GODO KAISHA IP BRIDGE 1
Reel/Frame 032152/0514 →
Assignment of Assignor's Interest Oct 6, 2014
From: GODO KAISHA IP BRIDGE 1
To: PANASONIC CORPORATION
Reel/Frame 033896/0723 →
Assignment of Assignor's Interest May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →